A heat collector (50) is formed by at least one extruding step for reducing machining steps, and is assembled to a separately formed mounting frame (40) which may be stamped and formed or molded. The heat collector has flanges (53) which bear against retaining tabs (45) formed on the mounting frame, and may be held by solder, glue, or mechanical means. The heat collector may receive a heat dissipator (18), or may be formed as a heat sink (56) such as a pin-fin type heat sink. The mounting frame can be fixed to a printed circuit board or the like having a component such as a central processing unit which contacts the collector in order to cool the unit.