A hybrid cooling system for cooling electronic devices includes a heat generating electronic device and an endless metal belt in sliding contact with a surface of the device for removing heat by conduction. The system also includes a fan or jet and an airfoil with and without a movable surface and/or flap for simultaneously directing a flow of coolant across the electronic device and/or the endless metal belt. An additional cooling element and cooling fins are also disclosed. Further, a method for cooling such devices is disclosed.