A lead conductor member for a thin-film magnetic head, includes a plurality of head connection pads to be connected to a plurality of terminal electrodes of a thin-film magnetic head element, a plurality of external connection pads used for external connections, a plurality of trace conductors, one end of each of the plurality of trace conductors being connected to the plurality of head connection pads and the other ends of the plurality of trace conductors being connected to the plurality of external connection pads, respectively, and at least one pair of test connection pads capable of being temporally and electrically short-circuited with at least one pair of trace conductors of the plurality of trace conductors, respectively.