A glass ceramic sintered body containing gahnite and cordierite as crystal phases, having a thermal expansion coefficient at 40 to 400 C. of not larger than 510-6/ C., a dielectric constant of not larger than 7 and a Young's modulus of not larger than 150 GPa. A wiring board having an insulating substrate made of the glass ceramic sintered body features very high reliability in the primary mounting and in the secondary mounting.

 
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< Lead-less surface mount reed relay

< Thermally enhanced component substrate: thermal bar

> Circuit board for connecting an integrated circuit to a support and IC BGA package using same

> Wiring board comprising granular magnetic film

~ 00214