A method of making a semiconductor device includes a back-grinding step of grinding a back surface of a semiconductor substrate, a dicing step of dicing the semiconductor substrate along predetermined dicing lines so as to make pieces of semiconductor devices after the back-grinding step, and a laser exposure step of shining laser light on the back surface of the semiconductor substrate after the back-grinding step so as to remove grinding marks generated by the back-grinding step.

 
Web www.patentalert.com

< Method and apparatus for correcting off-center laser ablations in refractive surgery

< Method of drilling holes with precision laser micromachining

> Method of producing vias and other conductor parts on an electrode terminal forming surface of a semiconductor wafer

> Controlling surface chemistry on solid substrates
~ 00212