A method and apparatus for inspecting a semiconductor device in which failure occurence conditions on a whole wafer are estimated by calculating the statistic of potential contrasts in pattern sections from sampled images to implement higher throughput, and defective conditions of a process are detected at an early stage with the help of time series data of the estimate result.

 
Web www.patentalert.com

< Detection apparatus for road obstructions

< Optical inspection apparatus for substrate defect detection

> Method for quantization of histogram bin value of image

> Imaging device

~ 00212