A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a retrograde scanning technique for faster collinear cuts. Non-sequential cutting is also used to manage thermal effects and calibrated cuts are used for improved accuracy. Test voltage is controlled to avoid resistor damage.

 
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< Plasma CVD method

< Asymmetric transfer molding method and an asymmetric encapsulation made therefrom

> Pulsed processing semiconductor heating methods using combinations of heating sources

> Semiconductor light-emitting device

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