A semiconductor wafer cleaning formulation for use in semiconductor fabrication
comprising maleic acid and ethylene urea as essential components. The preferred
formulation comprises maleic acid, ethylene urea, at least one carboxylic acid
except maleic acid, at least one organic amine except ethylene urea and water.
The formulation can optionally comprise at least one selected from the group consisting
of an organic solvent, a chelating agent and a surfactant. The formulation is suitably
used for removal of residue from semiconductor wafers following a resist ashing
process, particularly for removal of residue from wafers containing delicate copper
interconnect and low-k or ultra low-k interlayer dielectrics structures. There
is also provided a method for cleaning the wafer by using the formulation.