Ag and Cu are added to a base material of a Sn/Pb/Bi composition. Since Bi is contained in greater quantities in Sn/Pb, the alloy has a low melting point (120 to 150.degree. C.) and is surely melted at reflow temperatures from 170 to 200.degree. C. Preferably, the addition amount of Ag is from 0.1 to 5 wt % and the addition amount of Cu is from 0.05 to 1.0 wt %. A low-melting alloy having all the required performances and excellent with view points of cost and safety and a cream solder using a powder of the alloy can be obtained.