A dough conditioner comprising from about 0.05 wt. % to about 50 wt. % azodicarbonamide at least a fraction of which is microencapsulated; from about 0.1 to about 50 wt. % ascorbic acid; from about 0.01 to about 10 wt. % L-cysteine; from about 0.01 to about 10 wt. % fungal amylase; from about 0.1 to about 50 wt. % hemicellulose; from about 0.01 to about 10 wt. % lipase, all on a flour carrier and all weight percents based on the total weight of the dough conditioner excluding the weight of the flour carrier.