A process, system, and kit for evaluating the relief of the skin using a substrate with an adhesive surface. The process includes the steps of applying the substrate onto a test zone of the skin so that the adhesive surface is in contact with the skin at contact locations; removing the substrate; and evaluating the image formed on the adhesive surface. The image results from the modification of the adhesive surface at the contact locations. In a preferred embodiment, the adhesive surface, when applied to the skin, is not in appreciable contact with the sunken zones of the skin, such as the wrinkles or lines.