A heat dissipating apparatus. In one embodiment, a heat dissipating apparatus
is
comprised of a heat sink device having a plurality of cooling fins coupled to the
heat sink device. The heat sink device is adapted to be thermally coupled to a
heat source. The plurality of cooling fins are adapted to dissipate heat generated
by the heat source. An air duct is coupled with the heat sink device. The air duct
is for directing an airflow to the cooling fins to increase dissipation of the heat.