A light-receiving element having a light-receiving portion is formed on a chip surface. A digital circuit element, an analog circuit element and a circuit adjusting element are provided for cooperatively processing a detection signal produced from the light-receiving element. And, a light-shielding film is provided for selectively setting a light-receiving region on the chip surface.

 
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< Substrate processing apparatus, operation method thereof and program

< Integrated transistor devices

> Integration of barrier layer and seed layer

> BiCMOS technology on SOI substrates

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