An off-line partial wafer scanner system is disclosed that resolves partial wafermap related issues that result holt-lot in semiconductor assembly. The system eliminates the need to teach locator die at die attach (die bonder) machine. The reaching of partial map locator die is done in die interface areas instead of at the die bonder machine. This resolves the die quantity discrepancies issue, die bonder operator error and missing locator die information due to error made at the die bonder. An image-processing algorithm is employed to achieve reliable off-line locator die teaching system. In partial wafermap processing, the locator die is recognized by utilizing a vision system. A production operator records the wafer identification, and quarter or halves the wafer using a saw machine. The production operator scans the first quarter Q1 or first half H1 with a scanner and determines the locator die location as well as exact quantity of dies. The production operator uploads to a wafermap server the locator die location as well as exact quantity of dies. When dies are mounted from a partial wafer the production operator downloads from the wafermap server the locator die coordinates to a die mounting machine and the dies from any of the partial wafers are mounted using the downloaded locator die coordinates.