A recording head has a bottom pole layer and a top pole layer that include pole portions opposed to each other, a recording gap layer being placed between the pole portions. The recording head further has a thin-film coil. A raised portion is formed on a top surface of the recording gap layer in a region where a connecting portion of the thin-film coil is to be located. The coil is formed such that the connecting portion is formed on top of the raised portion. An insulating layer covers the coil and a top surface of the insulating layer is flattened. The connecting portion of the coil is only exposed from the top surface of the insulating layer. A conductive layer to be a lead is connected to the exposed connecting portion.