A device including a first solder pad and a second solder pad comprised of a
post-soldering
alloy composition on a substrate is provided. The alloy composition comprises two
or more elements, and the post soldering alloy composition of the first solder
pad has different amounts of the two or more elements than the alloy composition
of the second solder pad. A method of making a solder pad comprises masking a substrate
comprising at least a first solder pad and a second solder pad, wherein the mask
exposes a greater area of the first solder pad so that the deposited element becomes
part of an alloy composition of the first solder pad upon soldering thereby changing
the melting point of the first solder pad.
