A device and manufacturing method are provided that comprises forming first and
second substrates joined together and comprising a main channel provided in at
least one of the substrates and a connecting channel provided in at least one of
the substrates, the connecting channel connected to the main channel, and the main
channel having spaced apart electrodes and at least partially filled with liquid
metal. The method further comprises forming a heater substrate comprising a suspended
heater element in fluid communication with the connecting channel, the suspended
heater element operable to cause a fluid non-conductor to separate the liquid metal
and selectively interconnect the electrodes, and providing a high-frequency signal
loss reduction structure between the main channel and the heater substrate.
