Disclosed is a semiconductor die having a scanning area. The semiconductor
die includes a first plurality of test structures wherein each of the test structures
in the first plurality of test structures is located entirely within the scanning
area. The semiconductor die further includes a second plurality of test structures
wherein each of the test structures in the first plurality of test structures is
located only partially within the scanning area. The test structures are arranged
so that a scan of the scanning area results in detection of defects outside of
the scanning area.
