A device transfer method includes the steps of: covering a plurality of devices,
which have been formed on a substrate, with a resin layer; forming electrodes in
the resin layer in such a manner that the electrodes are connected to the devices;
cutting the resin layer, to obtain resin buried devices each containing at least
one of the devices; and peeling the resin buried devices from the substrate and
transferring them to a device transfer body. This device transfer method is advantageous
in easily, smoothly separating devices from each other, and facilitating handling
of the devices in a transfer step and ensuring good electric connection between
the devices and external wiring, even if the devices are fine devices.
