The invention relates to a method of forming electrical connection means
on a substrate, which method comprises the following steps:
a) depositing an intermediate layer of material (14) on a substrate (10),
b) forming an etching mask having at least one window,
c) etching the layer of intermediate material in conformity with the mask
in order to form at least one aperture therein,
d) coating the lateral side-walls of the aperture with a spacer (22) in
order to narrow the aperture,
e) depositing at least one conductor material (24) so as to fill the
narrowed aperture, and
f) performing an abrasion operation so as to remove excess conductor
material outside the aperture.
The invention is used for the realization of wiring tracks, contact pads
and vias.
