In fabricating the magnetic head, a first magnetic shield layer (S1) is
fabricated upon a substrate base, followed by a thin first insulation layer (G1).
A photoresist mask is fabricated upon the G1 layer and electrical lead recesses
are milled through the G1 layer and into the S1 layer. An insulation
layer is deposited into the electrical lead recesses, followed by the fabrication
of electrical leads within the recesses. The photoresist is removed and a magnetoresistive
(MR) sensor is subsequently fabricated on top of the G1 layer, such that
portions of the MR sensor are fabricated on top of portions of the electrical leads.
Hard bias elements are then fabricated at outboard edges of the MR sensor. A thin
second insulation layer (G2) is fabricated on top of the MR sensor and hard
bias elements, and a second magnetic shield layer (S2) is fabricated on
top of the G2 layer.