Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument

   
   

First and second electrodes and first and second electrical connection portions are overlapped and electrically connected. A first substrate includes: an attachment portion, a connection portion and an extension portion, the attachment portion being attached to the second substrate, the connection portion being connected to the attachment portion and positioned outside the second substrate, and the extension portion being extending from the connection portion along an edge of the second substrate without overlapping the second substrate. The first electrical connection sections are formed on the extension portion of the first substrate.

 
Web www.patentalert.com

< Apparatus and method for driving multi-color light emitting display panel

< Liquid crystal display

> Aromatic polycarbonate resin, electrophotographic photoconductor, process cartridge, and electrophotographic image forming method and apparatus

> Light-emitting element and method of producing the same

~ 00194