A method of connecting a conductive trace to a semiconductor chip includes providing
a semiconductor chip, a conductive trace and a metal base, wherein the chip includes
a conductive pad, and the conductive trace is disposed between the metal base and
the chip, then forming a through-hole that extends through the metal base and exposes
the conductive trace and the pad, then forming a connection joint that contacts
and electrically connects the conductive trace and the pad in the through-hole,
and then etching the metal base, thereby reducing contact area between the metal
base and another material. Preferably, the through-hole extends through an insulative
adhesive that attaches the conductive trace to the chip, and etching the metal
base reduces contact area between the metal base and the connection joint.
