A multi-opening heat-dissipation device for high-power electronic components
includes
a body, an extension extended from the body, and a radial fan. The radial fan is
mounted on a bottom aperture of the body. The body further comprises a primary
opening on a first face and a cavity communicating between the bottom aperture
and the primary opening as a wind path. The body further includes at least one
additional opening on a second face of the body. The at least one additional comprises
a second opening faces a circuit board on which a high-power electronic component
is mounted. The cool air can flow to at least one of the topside and bottom side
of the circuit board through the second opening and cool the high-power electronic
components directly.
