A retaining ring to be fitted on a chemical mechanical polishing apparatus for
semiconductor wafers is disclosed, the retaining ring comprising a carrier ring
made of a first material and having fitting elements for fitting the carrier ring
on the polishing apparatus; and a bearing ring comprising a plastic material, arranged
concentrically on the carrier ring, the bearing ring resting with a first front
side on a polishing surface of the polishing apparatus and being held on its side
axially opposed to the first front side releasably, non-rotatably, with a positive
and/or frictional connection and without adhesive on the carrier ring; wherein
the first material has a higher rigidity than the plastic material of the bearing ring.
