The present invention discloses a method including providing a substrate; forming
a lower conductor over the substrate; forming a conducting nanostructure over the
lower conductor; forming a thin dielectric over the conducting nanostructure; and
forming an upper conductor over the thin dielectric.
The present invention further discloses a device including a substrate; a lower
conductor located over the substrate; a conducting nanostructure located over the
lower conductor; a thin dielectric located over the conducting nanostructure; and
an upper conductor located over the thin dielectric.
