A high-frequency signal from a tape-shaped line section having a surface layer
signal lead and surface layer GND lead disposed on both sides thereof is directly
inputted to a semiconductor chip via a signal surface layer wiring of a package
substrate and through solder bump electrodes. Alternatively, a high-frequency signal
from the semiconductor chip is outputted to the outside via the tape-shaped line
section in reverse. Owing to the transmission of the high-frequency signal by only
a microstrip line at the whole surface layer of the package substrate, the high-frequency
signal can be transmitted by only the microstrip line at the surface layer without
through vias or the like. Accordingly, the high-frequency signal can be transmitted
without a loss in frequency characteristic, and a high-quality high-frequency signal
can be transmitted with a reduction in loss at high-frequency transmission.
