Cooling means are provided for directing cooling air over a desired portion
of an electronic components card. A deflector attachable to the electronic components
card for directing cooling air over the card is provided. The deflector is adapted
to be moved with respect to the card to direct cooling air over different portions
of the card. The deflector includes a scoop extending along the plane of the card
and beyond the edge of the card when the deflector is attached to the card for
redirecting cooling air over the card. The deflector can include a pair of walls
having spaced apart interior surfaces forming a channel for receiving the card
for attaching the deflector to the card. A method for cooling an electronic components
card includes providing a deflector having a scoop for redirecting cooling air
and attaching the deflector to the card so that the scoop directs cooling air over
the card to cool the electronic components. The method includes attaching the deflector
at a desired location along the card edge to direct air over a desired portion
of the card.
