A high-frequency module includes a dielectric plate in which a resonator is formed
and a cover for covering the dielectric plate. A hole is provided in the cover.
A laser beam for laser trimming passes through the hole. The area of opening and
the depth of the hole are defined so that electromagnetic waves in a usable frequency
band are cut off in the hole. An electrical characteristic is measured in a state
where all components including the cover are assembled, and laser trimming is performed
through the hole so as to obtain a desired characteristic.
