A stereolithographic method and apparatus for applying packaging material to
workpieces,
such as preformed electronic components, including semiconductor dice, with a high
degree of precision, and resulting articles. A machine vision system including
at least one camera is operably associated with a computer controlling a stereolithographic
system for application of material so that the system may recognize the position
and orientation of workpieces, such as semiconductor dice, to which the material
is to be applied. The requirement for precise mechanical workpiece alignment is
eliminated, and the ability of the system to recognize size, configuration and
topography of different workpieces affords greater manufacturing flexibility. The
method includes stereolithographic application of material for packaging electronic
components, and the electronic components so packaged are also part of the invention.
