Disclosed is a method for forming a semiconductor assembly and the resulting
assembly in which a flowable adhesive material which secures a die to a support
and does not form an adhesive fillet. A flowable adhesive is deposited between
the die and support so that it covers about 50 to about 90 percent of the bottom
surface area of the die after the die is mounted to the support. The reduced surface
coverage area prevents formation of an adhesive fillet.
