By use of a simple structure, also without enlarging thickness and size too much,
provided is a light emitting module which can improve heat dissipation of a light
emitting component. On a surface of a wiring substrate, a pair of lands face to
each other, and two wiring line is connected to the land, respectively. A mounting
side outside electrode of a light emitting component is connected to a lead frame
to which a light emitting element is die-bonded, and a non-mounting side outside
electrode is connected to a lead frame which is connected to the light emitting
element through a bonding wire. And, the mounting side outside electrode is bonded
to the land by solder, and the non-mounting side outside electrode is bonded to
the land by solder and thereby, the light emitting component is mounted on the
wiring substrate. A line width of the wiring line at a side to which the mounting
side outside electrode of the light emitting component is soldered is made to be
larger than a line width of the wiring line at a side to which the non-mounting
side outside electrode is soldered.
