A semiconductor device comprising a semiconductor chip with plural electrodes
arranged
on a main surface thereof, plural leads electrically connected respectively to
the plural electrodes on the semiconductor chip, and a resin sealing body which
seals the semiconductor chip and the plural leads, wherein the plural leads include
first leads and second leads adjacent to the first leads, the first leads having
first external connections exposed from a mounting surface of the resin sealing
body and positioned near a side face of the resin sealing body, the second leads
having second external connections exposed from the mounting surface of the resin
sealing body and positioned closer to the semiconductor chip with respect to the
first external connections. The first and second leads are fixed to the semiconductor
chip. The semiconductor device is suitable for a multi-pin structure and the manufacturing
yield thereof is improved.
