A semiconductor package device includes an insulative housing, a semiconductor
chip, a terminal and a lead, wherein the insulative housing includes a top surface,
a bottom surface, and a peripheral side surface between the top and bottom surfaces,
the chip includes a conductive pad, the terminal protrudes downwardly from and
extends through the bottom surface and is electrically connected to the pad, the
lead protrudes laterally from and extends through the side surface and is electrically
connected to the pad, the terminal and the lead are spaced and separated from one
another outside the insulative housing, and the terminal and the lead are electrically
connected to one another inside the insulative housing and outside the chip.
