A system for cooling at least two electronic components comprises a plurality
of
graphitic foam products which are each thermally coupled to a corresponding component,
a plurality of housings which are each mounted over a corresponding foam product
and which each comprise an inlet and an outlet, a source of cooling fluid, and
a conduit which is connected between the fluid source and each inlet. In operation,
fluid is communicated from the fluid source to each housing through the conduit
to thereby cool the components.
