An electronic assembly that may include an integrated circuit package that is
mounted to a substrate. The assembly may have a thermally conductive phase change
material that couples the integrated circuit package to a thermal element. The
phase change material may be assembled in a liquid phase to fill any gap between
the package and the thermal element. The phase change material may exist in a solid
phase during normal operation of the assembly so that the material does not bleed
from the package/thermal element interface.
