An integrated circuit inductor includes a spiral pattern disposed upon a substrate.
The track of the spiral is divided into multiple tracks to form a multi-track inductor.
The individual tracks are disposed side by side and in different layers. Tracks
that are aligned vertically are coupled by feed throughs, or vias. Multiple vias
are used along the length of each of the multiple tracks. Tracks disposed in the
same layer are joined together at their beginning, and at their termination. A
patterned shield is fabricated from conductive fingers of n+ salicided material
that is separated by non conducting polysilicon that fills the gaps between the
fingers. The conductive fingers are coupled together in groups, which are in turn
tied to a single point ground. In tying the groups together, a gap in the conducting
path is provided to prevent ground loop currents. The shield is disposed between
the multi-track inductor and the substrate.
