A cooling system for an electronic device includes an air flow conduit for causing
air outside a housing of the device to flow through a heat dissipation device.
The conduit is configured to prevent substantial transfer of heat from air contained
within the conduit and air in the remainder of the housing. The conduit walls include
thermal and/or acoustic insulation. One or more fans in the conduit draw outside
air into the conduit and expel air in the conduit to outside the housing.
