Techniques for utilizing a microscope inspection system capable of
inspecting specimens at high throughput rates are described. The
inspection system achieves the higher throughput rates by utilizing more
than one detector array and a large field of view to scan the surface of
the semiconductor wafers. The microscope inspection system also has high
magnification capabilities, a high numerical aperture, and a large field
of view. By using more than one detector array, more surface area of a
wafer can be inspected during each scanning swath across the semiconductor
wafers. The microscope inspection system is configured to have a larger
field of view so that the multiple detector arrays can be properly
utilized. Additionally, special arrangements of reflective and/or
refractive surfaces are used in order to fit the detector arrays within
the physical constraints of the inspection system.
