A modular wall component with an insulative thermal break for preventing
the creation of a continuous thermal path across the modular wall
component. The modular wall component may be formed with an insulated
frame structure that is fixed to an open frame structure with an
insulative thermal break interposed therebetween. The insulated frame
structure may be formed with a plurality of vertical track members coupled
to an upper track member and a lower track member. At least one sheet of
insulative material is interposed into the insulated frame structure. The
open frame structure may have a plurality of vertical framing studs
coupled to an upper framing track and a lower framing track.
