Disclosed is a label for in-mold forming comprising a thermoplastic resin
film base layer and a heat-seal resin layer, wherein a surface of the
heat-seal resin layer has a centerline average roughness of 0.5 to 5
micrometers and the label has an air permeability of 10 to 20,000 seconds.
When in-mold forming is conducted with the label of the present invention,
labeled molded resin articles of various shapes can be manufactured while
effectively inhibiting blistering.
