Methods of forming via plugs using an aerosol stream of particles to deposit conductive materials

   
   

An aerosol stream of particles of a conductive material is directed into a via of an integrated circuit device to deposit the conductive material within the via to form a via plug.

Un flusso dell'aerosol delle particelle di un materiale conduttivo รจ diretto nella a via di un dispositivo del circuito integrato per depositare il materiale conduttivo all'interno del via per formare la a via la spina.

 
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