Semiconductor device, semiconductor packaging method, assembly and method for fabricating the same

   
   

A semiconductor device includes a semiconductor element having a plurality of element electrodes and a ball electrode electrically connected to at least one element electrode out of the plurality of element electrodes. The ball electrode is made of a Sn--Zn-based lead-free solder including 7 through 9.5 wt % of zinc and the remaining of tin.

Um dispositivo de semicondutor inclui um elemento do semicondutor que tem um plurality dos elétrodos do elemento e de um elétrodo da esfera conectado eletricamente ao menos a um elétrodo do elemento fora do plurality dos elétrodos do elemento. O elétrodo da esfera é feito de um sn -- solda lead-free Zn-baseada including 7 a 9.5 pesos % do zinco e o restante da lata.

 
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