Platinum silicide permeation layer device with microlocaions

   
   

Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.

Los microchipes electrónicamente direccionables covalente que limitan capas de la impregnación y métodos de hacer tales capas covalente consolidadas de la impregnación a los microchipes se proporcionan. La vinculación covalente se deriva de combinar el uso de electrodos con los derivados del silane. Tal química proporciona la capacidad de aplicar un diagonal electrónico a los electrodos del microchip mientras que previene la capa de la impregnación delaminating de la superficie del electrodo.

 
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