A natural-resource-conservative, environmentally-friendly, cost-effective,
leadless semiconductor packaging apparatus, having superior mechanical and
electrical properties, and having an optional windowed housing which
uniquely seals and provides a mechanism for viewing the internally
packaged integrated semiconductor circuits (chips/die). A uniquely stamped
and/or bent lead-frame is packaged by a polymeric material during a unique
compression-molding process using a mold, specially contoured to avoid the
common "over-packaging" problem in related art techniques. The specially
contoured mold facilitates delineation of the internal portions from the
external portions of the lead-frame, as the external portions are the
effective solderable areas that contact pads on a printed circuit board,
thereby avoiding a laborious environmentally-unfriendly masking step and
de-flashing step, streamlining the device packaging process. The
compression-mold effectively provides a compressive sealing orifice from
which the effective solderable areas of the lead-frame may extend and be
exposed and, thus, avoid being coated with the polymer which is uniquely
contained by the mold for packaging the internal portions of the
lead-frame. The lead-frame is uniquely stamped and/or bent, conforming it
to electro-mechanical requirements of a particular semiconductor product.
By uniquely stamping and/or bending, the related art "half-etching" of the
lead for conforming it to electromechanical requirements of the packaged
semiconductor product is no longer required. Environmental enhancement is
achieved by conserving natural resources and by eliminating hazardous
material by-products otherwise liberated in related art packaging
techniques.
