A method of bonding and packaging components of Micro-Electro-Mechanical
Systems (MEMS) and MEMS based devices using a Solid-Liquid InterDiffusion
(SLID) process is provided. A micro-machine is bonded to a micro-machine
chip using bonding materials. A layer of chromium is first deposited onto
surfaces of the micro-machine and the micro-machine chip followed by a
layer of gold. Subsequently, a layer of indium is deposited between the
layers of gold, and the surface of the micro-machine is pressed against
the surface of the micro-machine chip forming a gold-indium alloy to serve
as a bond between the micro-machine and the micro-machine chip. In
addition, a cover is bonded to the micro-machine chip in the same manner
providing a hermetic seal for the MEMS based device.
