Barrier film integrity on porous low k dielectrics by application of a hydrocarbon plasma treatment

   
   

A method for treating a dielectric material using hydrocarbon plasma is described, which allows for thinner films of barrier material to be used to form a robust barrier.

Um método para tratar um material dieléctrico que usa o plasma do hidrocarboneto é descrito, que permite umas películas mais finas do material da barreira para ser usado dar forma a uma barreira robust.

 
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