An apparatus and method for processing a microelectronic workpiece at an
elevated temperature. In one embodiment, the apparatus includes a
workpiece support positioned to engage and support the microelectronic
workpiece during operation. The apparatus can further include a heat
source having a solid engaging surface positioned to engage a surface of
the microelectronic workpiece with at least one of the heat source and the
workpiece support being movable relative to the other between a first
position with the microelectronic workpiece contacting the engaging
surface of the heat source and a second position with the microelectronic
workpiece spaced apart from the engaging surface. The heat source is sized
to transfer heat to the microelectronic workpiece at a rate sufficient to
thermally process a selected material of the microelectronic workpiece
when the microelectronic workpiece is engaged with the heat source. A heat
sink can be positioned at least proximate to the heat source to cool both
the heat source and the microelectronic workpiece.
