Circuit boards (1100, 1500, 1600, 1700) and methods for fabricating circuit
boards that include heaters for maintaining temperature sensitive
components at an operating temperature are provided. Resistive traces
(602, 702,704) are included in the circuit boards proximate temperature
sensitive apparatus (1004, 1304, 1602, 1712). Thermally conductive patches
(802, 902, 904) are interposed between the resistive traces and the
temperature sensitive components. The thermally conductive patches
establish zones of relatively uniform temperatures. According to a
preferred embodiment of the invention the temperature sensitive apparatus
comprises a fluid conduit (1004).
