The present invention provides inter alia electroplating compositions,
methods for use of the compositions and products formed by the
compositions. Electroplating compositions of the invention are
characterized in significant part by a grain refiner/stabilizer additive
comprising one or more non-aromatic compounds having .pi. electrons that
can be delocalized, e.g., an .alpha.,.beta. unsaturated system or other
conjugated system that contains a proximate electron-withdrawing group.
Compositions of the invention provide enhanced grain refinement and
increased stability in metal plating solutions, particularly in tin and
tin alloy plating formulations.
